(주)탑에이테크놀로지는 인천 남동공단에 위치한 몰드&툴, 반도체 자동화장비, 환경시험장비 및 오븐&챔버, 자동차부품시험장비 제작
그리고 정밀부품을 가공하는 업체로 고객의 요구에 100%만족하는 제품을 만들기 위해
직원 모두가 노력하고 있습니다.
TRIM & FORM SYSTEM(CAM PRESS)
- This distinguished ‘Wafer image capture system’ will
- improve the manufacturing process.
- This will save much need production space that will be
- freed by not keeping the actual ‘Physical skeleton wafer’.
- Because this system stores the skeleton wafer images in
- the computer.
- After die bonding, the camera captures the image of the
- wafer ring and the remnant defective / unit on the tape.
- The system makes a comparison between this image and
- wafer inspection data in the server. Thus a real-time
- information could be obtained if the defective units were
- As a competitive equipment manufacturer with high
- technologies, Top-A offers its customers a system for work
- traceability of die pick and place.
- Barcode scanner for wafer ID (To create image file name)
- High resolution camera (5M pixel) wafer frame cassette
- loader (Max. 3cassettes loading)
- PC based operation 8”/12” wafer convertible type
- (Conversion time : 1minitue)
- Full automatic image capture / transfer / storage
- Die pick & place of the validity verification by
- interconnection with wafer map system (Optional)
- Footprint(mm) : 1450(W) x 1175(L) x 2000(H) 740kg
- Applicable for all device tool.
- Gripper type Pick and Place.
- X, Y, Z servo robot.
- Ultrasonic cleaning.
- High pressure shower.
- Hot dry oven(150℃).
- Vision system.
- PC control.
- User friendly touch screen.
- Full auto loading and un-loading.
- Touch screen for oven controller.
- This is a cleaning machine for flux tool of ball attach
- There are a lot of touch probe pins with small springs on
- the flux tool.
- The touch probe pins should undergo periodic cleaning.
- Because the flux drift through out the spring which
- results to the inability of the spring to move well due to.
- sticky flux inside.
- This machine will clean the flux tool and solve your