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생산설비현황

(주)탑에이테크놀로지주요생산품목

(주)탑에이테크놀로지는 인천 남동공단에 위치한 몰드&툴, 반도체 자동화장비, 환경시험장비 및 오븐&챔버, 자동차부품시험장비 제작
그리고 정밀부품을 가공하는 업체로 고객의 요구에 100%만족하는 제품을 만들기 위해
직원 모두가 노력하고 있습니다.

반도체자동화장비

  • TRIM & FORM SYSTEM(CAM PRESS)

    - Compact Machine size, High Throughput.
    - Easy Integration with other Process.
    - Modular system Design.
    - Quick & Easy Conversion System.
    - Inspects Various Items without Sacrificing UPH.
    - Reject Unit Sorting System.
    - User Friendly operation with Various Information System.
    - Perfect Quality with Highly Accurate Tool.
    - Stroke Speed Control.
    - Real-Time spc Monitoring & Graphic Display.
    - MTBA/MTBF Data.
    - Vision System (Option).

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    TRIM & FORM SYSTEM(CAM PRESS)

  • Auto frame loader

    Auto frame loader

    - Compact Machine size.
    - User Friendly operation with Various Information System.
    - Easy Maintenance by Self-diagnosis.
    - 4Axis at the Same Time.
    - Suitable to Quantity Production.
    - Easy Convertibility Type.
    - Equipped Safety Sensors in Every Loading System.

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  • Cam press for T.R PKG.

    Cam press for T.R PKG.

    - Compact Machine size.
    - High Throughput.
    - Easy Integration with other Process.
    - User Friendly operation with Various Information System.
    - Perfect Quality with Highly Accurate Tool.
    - Stroke Speed Control.
    - Real-Time spc Monitoring & Graphic Display.
    - Modular Tool Design.
    - Inspects Various Items without Sacrificing UPH.
    - MTBA/MTBF Data.
    - Vision System (Option).

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  • Cam press for M-BGA singulation system

    Cam press for M-BGA singulation system

    - High Through Put.
    - Defect Free Quality by 3Step Vision Inspection.
    - Sorting Function of Rejected Package with out Machine

    - Stop.
    - Easy Maintenance by Self-diagnosis.
    - Tape Remove Unit.
    - User friendly Software with Various Information System.

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  • Trim & form die

    Trim & form die

    - Q.C.C Modular Design.
    - Easy Change & Cleaning for Tool Parts.
    - Module Change for Different Lead Count & Form Option.
    - Diamond Coating for All Forming Parts.
    - Longer Life Time.
    - Less Solder Build-Up.
    - MisFeed Detection.
    - Un-Cut Dambar Detection(Mechanical Type).
    - Minimum in Flake Solder Build-up & foreign Materials.
    - Top and Bottom Module Self-Alignment Design.
    - Anti Vibration & Noise Protection Design.
    - Dambar Protrusion : Max 1.5mils.
    - Lead Coplanarity : Max 1.5mils.
    - Applied Package All Package.
    - Misfeed Sensor.

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  • Offloading system for BGA

    Offloading system for BGA

    - Full Auto Change for Device.
    - Scara Robot of Pick & Place.
    - Applied PKG. : All Device.

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  • Magazine cleaning system

    Magazine cleaning system

    - Manual loading and un-loading.
    - High pressure water shower.
    - High pressure air shower.
    - Hot dry oven(150℃).
    - Speed control motor conveyer.
    - Every zoon air curtain.
    - Using every device magazine and tray.
    - Re-cycling water.
    - Vacuum system(5Hp).
    - PLC control.
    - User friendly touch screen.
    - Cartridge type water filter.
    - Stainless water pump.
    - Stainless steel chain conveyor.
    - Conveyor move and stop sensor.
    - All stainless steel body.

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  • Wafer image capture system

    Wafer image capture system

    - This distinguished ‘Wafer image capture system’ will

    - improve the manufacturing process.

    - This will save much need production space that will be

    - freed by not keeping the actual ‘Physical skeleton wafer’.

    - Because this system stores the skeleton wafer images in

    - the computer.

    - After die bonding, the camera captures the image of the

    - wafer ring and the remnant defective / unit on the tape.

    - The system makes a comparison between this image and

    - wafer inspection data in the server. Thus a real-time

    - information could be obtained if the defective units were

    - assembled.

    - As a competitive equipment manufacturer with high

    - technologies, Top-A offers its customers a system for work

    - traceability of die pick and place.

    - Barcode scanner for wafer ID (To create image file name)

    - High resolution camera (5M pixel) wafer frame cassette

    - loader (Max. 3cassettes loading)

    - PC based operation 8”/12” wafer convertible type

    - (Conversion time : 1minitue)

    - Full automatic image capture / transfer / storage

    - Die pick & place of the validity verification by

    - interconnection with wafer map system (Optional)

    - Footprint(mm) : 1450(W) x 1175(L) x 2000(H) 740kg

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  • Flux tool cleaning system

    Flux tool cleaning system

    - Applicable for all device tool.
    - Gripper type Pick and Place.
    - X, Y, Z servo robot.
    - Ultrasonic cleaning.
    - High pressure shower.
    - Hot dry oven(150℃).
    - Vision system.
    - PC control.
    - User friendly touch screen.
    - Full auto loading and un-loading.
    - Touch screen for oven controller.

    - This is a cleaning machine for flux tool of ball attach

    - equipment.

    - There are a lot of touch probe pins with small springs on

    - the flux tool.

    - The touch probe pins should undergo periodic cleaning.

    - Because the flux drift through out the spring which

    - results to the inability of the spring to move well due to.

    - sticky flux inside.

    - This machine will clean the flux tool and solve your

    - problem.

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  • Pick and place

    Pick and place

    - Boat to tray & tray to boar.
    - The Flipper application provides PKG Orientation change.
    - Easy & quick conversion.
    - Vision Inspection System.
    - Damage-free Boat &Tray Indexing System.
    - High Productivity & Reliability.
    - High throughput with Dual Picker Head Structure.

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  • Auto dispensing&attach system

    Auto dispensing&attach system

    - Advanced process control.
    - Automated fluid dispensing & attach system to satisfy a
    - wide variety of production requirements.
    - Easy operation and data management.
    - High resolution CCD camera.
    - PRS vision & vision inspection.
    - Automatic alignment PRS alignment and laser height.
    - Calibration for dual dispensing and pick & place user friendly
    - operability.
    - Easy device conversion.
    - Overload detector for strip pusher and dual pick & place.

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  • Laser marking system