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Top-A TechnologyPRODUCT

invents and manufactures semiconductor manufacturing equipment and environmental testing equipment,
including LED/LCD equipment, ovens, chambers, and automobile parts testing equipment
for sale both domestically and overseas.

AUTO SYSTEM FOR SEMICONDUCTOR, LCD AND LED

  • Conventional mold

    - Various Molding Capacity up to 12Chase
    - Mismatch & Misalign : max 1.5~2 mils
    - High Productivity with Minimum Investment
    - No Resin & No Flash
    - Compound Saving Design
    - Highest Molding quality
    - Built in Hydraulic unit for Multi Plunger Movement
    - Best Compound Flow & Minimum Wire Sweep
    - Applied PKG : All Device

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    Conventional mold

  • SEMI-MGP mold

    SEMI-MGP mold

    - Various Molding Capacity up to 4Chase
    - Mismatch & Misalign : max 1.5~2 mils
    - High Productivity with Minimum Investment
    - No Resin & No Flash
    - Compound Saving Design
    - Highest Molding quality
    - Built in Hydraulic unit for Multi Plunger Movement
    - Best Compound Flow & Minimum Wire Sweep
    - Applied PKG : All Device

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  • MGP mold

    MGP mold

    - Various Molding Capacity up to 4Chase
    - Mismatch & Misalign : max 1.5~2 mils
    - High Productivity with Minimum Investment
    - No Resin & No Flash
    - Compound Saving Design
    - Highest Molding quality
    - Built in Hydraulic unit for Multi Plunger Movement
    - Best Compound Flow & Minimum Wire Sweep
    - Applied PKG : All Device

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  • Auto mold chase

    Auto mold chase

    - Mismatch & Misalign : max 1~1.5mils
    - Chase Design : Q. C. C
    - High Productivity with Minimum Investment
    - No Resin & No Flash
    - Compound Saving Design
    - Highest Molding quality
    - Built in Hydraulic unit for Multi Plunger Movement
    - Best Compound Flow & Minimum Wire Sweep
    - Applied PKG : All Device

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  • Auto frame loader

    Auto frame loader

    - Compact Machine size
    - User Friendly operation with Various Information System
    - Easy Maintenance by Self-diagnosis
    - 4Axis at the Same Time
    - Suitable to Quantity Production
    - Easy Convertibility Type
    - Equipped Safety Sensors in Every Loading System

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  • Cam press for I.C PKG.

    Cam press for I.C PKG.

    - Compact Machine size, High Throughput
    - Easy Integration with other Process
    - Modular system Design
    - Quick & Easy Conversion System
    - Inspects Various Items without Sacrificing UPH
    - Reject Unit Sorting System
    - User Friendly operation with Various Information System
    - Perfect Quality with Highly Accurate Tool
    - Stroke Speed Control
    - Real-Time spc Monitoring & Graphic Display
    - MTBA/MTBF Data
    - Vision System (Option)

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  • Cam press for T.R PKG.

    Cam press for T.R PKG.

    - Compact Machine size
    - High Throughput
    - Easy Integration with other Process
    - User Friendly operation with Various Information System
    - Perfect Quality with Highly Accurate Tool
    - Stroke Speed Control
    - Real-Time spc Monitoring & Graphic Display
    - Modular Tool Design
    - Inspects Various Items without Sacrificing UPH
    - MTBA/MTBF Data
    - Vision System (Option)

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  • Cam press for M-BGA singulation system

    Cam press for M-BGA singulation system

    - High Through Put
    - Defect Free Quality by 3Step Vision Inspection
    - Sorting Function of Rejected Package with out Machine

    - Stop
    - Easy Maintenance by Self-diagnosis
    - Tape Remove Unit
    - User friendly Software with Various Information System

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  • Trim & form die

    Trim & form die

    - Q.C.C Modular Design
    - Easy Change & Cleaning for Tool Parts
    - Module Change for Different Lead Count & Form Option
    - Diamond Coating for All Forming Parts
    - Longer Life Time
    - Less Solder Build-Up
    - MisFeed Detection
    - Un-Cut Dambar Detection(Mechanical Type)
    - Minimum in Flake Solder Build-up & foreign Materials
    - Top and Bottom Module Self-Alignment Design
    - Anti Vibration & Noise Protection Design
    - Dambar Protrusion : Max 1.5mils
    - Lead Coplanarity : Max 1.5mils
    - Applied Package All Package
    - Misfeed Sensor

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  • Offloading system for BGA

    Offloading system for BGA

    - Full Auto Change for Device
    - Scara Robot of Pick & Place
    - Applied PKG. : All Device

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  • Magazine cleaning system

    Magazine cleaning system

    - Manual loading and un-loading
    - High pressure water shower
    - High pressure air shower
    - Hot dry oven(150℃)
    - Speed control motor conveyer
    - Every zoon air curtain
    - Using every device magazine and tray
    - Re-cycling water
    - Vacuum system(5Hp)
    - PLC control
    - User friendly touch screen
    - Cartridge type water filter
    - Stainless water pump
    - Stainless steel chain conveyor
    - Conveyor move and stop sensor
    - All stainless steel body

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  • Wafer image capture system

    Wafer image capture system

    - This distinguished ‘Wafer image capture system’ will

    - improve the manufacturing process.

    - This will save much need production space that will be

    - freed by not keeping the actual ‘Physical skeleton wafer’.

    - Because this system stores the skeleton wafer images in

    - the computer.

    - After die bonding, the camera captures the image of the

    - wafer ring and the remnant defective / unit on the tape.

    - The system makes a comparison between this image and

    - wafer inspection data in the server. Thus a real-time

    - information could be obtained if the defective units were

    - assembled.

    - As a competitive equipment manufacturer with high

    - technologies, Top-A offers its customers a system for work

    - traceability of die pick and place.

    - Barcode scanner for wafer ID (To create image file name)

    - High resolution camera (5M pixel) wafer frame cassette

    - loader (Max. 3cassettes loading)

    - PC based operation 8”/12” wafer convertible type

    - (Conversion time : 1minitue)

    - Full automatic image capture / transfer / storage

    - Die pick & place of the validity verification by

    - interconnection with wafer map system (Optional)

    - Footprint(mm) : 1450(W) x 1175(L) x 2000(H) 740kg

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  • Flux tool cleaning system

    Flux tool cleaning system

    - Applicable for all device tool
    - Gripper type Pick and Place
    - X, Y, Z servo robot
    - Ultrasonic cleaning
    - High pressure shower
    - Hot dry oven(150℃)
    - Vision system
    - PC control
    - User friendly touch screen
    - Full auto loading and un-loading
    - Touch screen for oven controller

    - This is a cleaning machine for flux tool of ball attach

    - equipment.

    - There are a lot of touch probe pins with small springs on

    - the flux tool.

    - The touch probe pins should undergo periodic cleaning.

    - Because the flux drift through out the spring which

    - results to the inability of the spring to move well due to

    - sticky flux inside.

    - This machine will clean the flux tool and solve your

    - problem.

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  • Pick and place

    Pick and place

    - Boat to tray & tray to boar
    - The Flipper application provides PKG Orientation change
    - Easy & quick conversion
    - Vision Inspection System
    - Damage-free Boat &Tray Indexing System
    - High Productivity & Reliability
    - High throughput with Dual Picker Head Structure

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