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Top-A TechnologyPRODUCT

invents and manufactures semiconductor manufacturing equipment and environmental testing equipment,
including LED/LCD equipment, ovens, chambers, and automobile parts testing equipment
for sale both domestically and overseas.

AUTO SYSTEM FOR SEMICONDUCTOR, LCD AND LED

  • TRIM & FORM SYSTEM(CAM PRESS)

    TRIM & FORM SYSTEM(CAM PRESS)

    - Compact Machine size, High Throughput.
    - Easy Integration with other Process.
    - Modular system Design.
    - Quick & Easy Conversion System.
    - Inspects Various Items without Sacrificing UPH.
    - Reject Unit Sorting System.
    - User Friendly operation with Various Information System.
    - Perfect Quality with Highly Accurate Tool.
    - Stroke Speed Control.
    - Real-Time spc Monitoring & Graphic Display.
    - MTBA/MTBF Data.
    - Vision System (Option).

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  • Cam press for T.R PKG.

    Cam press for T.R PKG.

    - Compact Machine size.
    - High Throughput.
    - Easy Integration with other Process.
    - User Friendly operation with Various Information System.
    - Perfect Quality with Highly Accurate Tool.
    - Stroke Speed Control.
    - Real-Time spc Monitoring & Graphic Display.
    - Modular Tool Design.
    - Inspects Various Items without Sacrificing UPH.
    - MTBA/MTBF Data.
    - Vision System (Option).

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  • Cam press for M-BGA singulation system

    Cam press for M-BGA singulation system

    - High Through Put.
    - Defect Free Quality by 3Step Vision Inspection.
    - Sorting Function of Rejected Package with out Machine

    - Stop.
    - Easy Maintenance by Self-diagnosis.
    - Tape Remove Unit.
    - User friendly Software with Various Information System.

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  • Trim & form die

    Trim & form die

    - Q.C.C Modular Design.
    - Easy Change & Cleaning for Tool Parts.
    - Module Change for Different Lead Count & Form Option.
    - Diamond Coating for All Forming Parts.
    - Longer Life Time.
    - Less Solder Build-Up.
    - MisFeed Detection.
    - Un-Cut Dambar Detection(Mechanical Type).
    - Minimum in Flake Solder Build-up & foreign Materials.
    - Top and Bottom Module Self-Alignment Design.
    - Anti Vibration & Noise Protection Design.
    - Dambar Protrusion : Max 1.5mils.
    - Lead Coplanarity : Max 1.5mils.
    - Applied Package All Package.
    - Misfeed Sensor.

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