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Top-A TechnologyPRODUCT

invents and manufactures semiconductor manufacturing equipment and environmental testing equipment,
including LED/LCD equipment, ovens, chambers, and automobile parts testing equipment
for sale both domestically and overseas.

MOLD & TOOL

  • Test book mold

    - For test and sample product.
    - spiral test mold.

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    Test book mold

  • Conventional mold

    Conventional mold

    - Various Molding Capacity up to 12Chase.
    - Mismatch & Misalign : max 1.5~2 mils.
    - High Productivity with Minimum Investment.
    - No Resin & No Flash.
    - Compound Saving Design.
    - Highest Molding quality.
    - Built in Hydraulic unit for Multi Plunger Movement.
    - Best Compound Flow & Minimum Wire Sweep.
    - Applied PKG : All Device.

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  • Auto mold chase

    Auto mold chase

    - For test and sample product.
    - any chase is available regardless.
    - auto molding system manufacturer.
    (Fico, Dai-ichi, Seiko, ASM, Towa and so on)
    - capable of reverse engineering.

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  • SEMI-MGP mold

    SEMI-MGP mold

    - Various Molding Capacity up to 4Chase.
    - Mismatch & Misalign : max 1.5~2 mils.
    - High Productivity with Minimum Investment.
    - No Resin & No Flash.
    - Compound Saving Design.
    - Highest Molding quality.
    - Built in Hydraulic unit for Multi Plunger Movement.
    - Best Compound Flow & Minimum Wire Sweep.
    - Applied PKG : All Device.

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  • MGP mold

    MGP mold

    - Various Molding Capacity up to 4Chase.
    - Mismatch & Misalign : max 1.5~2 mils.
    - High Productivity with Minimum Investment.
    - No Resin & No Flash.
    - Compound Saving Design.
    - Highest Molding quality.
    - Built in Hydraulic unit for Multi Plunger Movement.
    - Best Compound Flow & Minimum Wire Sweep.
    - Applied PKG : All Device.

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  • MGP and SEMI MGP mold die

    MGP and SEMI MGP mold die

    - Compound saving design.
    - highest molding quality with bottom transfer type.
    - applicable PKG : all device.

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  • Auto mold chase

    Auto mold chase

    - Mismatch & Misalign : max 1~1.5mils.
    - Chase Design : Q. C. C.
    - High Productivity with Minimum Investment.
    - No Resin & No Flash.
    - Compound Saving Design.
    - Highest Molding quality.
    - Built in Hydraulic unit for Multi Plunger Movement.
    - Best Compound Flow & Minimum Wire Sweep.
    - Applied PKG : All Device.

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  • QCC retractable mold die

    QCC retractable mold die

    - Compound saving design.
    - highest molding quality.
    - applicable PKG : full pack to 220.
    - two-step moving of E-pin during molding process.

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  • Trim, form and singulation tool

    Trim, form and singulation tool

    - Q.C.C Modular design.

    - Easy change & cleaning for tool parts.

    - Module change for different lead count & form option.

    - Diamond coating for all forming parts.

    - Longer life time-less solder build-up.

    - Mis feeding detection.

    - Un-cut dambar detection (Mechanical type).

    - Minimum in flake solder build-up & foreign materials.

    - Top and bottom module self-alignment design.

    - Anti vibration & noise protection design.

    - Dambar protrusion : max 1.5mils.

    - Lead capacity : max 1.5mils.

    - Applied package : all package.

    - Capable of reserve engineering.

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  • Precision injection mold die

  • Stamping mold die and tool