KOR

ALL

Close

CS Center

Top-A TechnologyPRODUCT

invents and manufactures semiconductor manufacturing equipment and environmental testing equipment,
including LED/LCD equipment, ovens, chambers, and automobile parts testing equipment
for sale both domestically and overseas.

MOLD & TOOL

  • Test book mold

    - For test and sample product
    - spiral test mold

    More View

    Test book mold

  • Conventional mold

    Conventional mold

    - Various Molding Capacity up to 12Chase
    - Mismatch & Misalign : max 1.5~2 mils
    - High Productivity with Minimum Investment
    - No Resin & No Flash
    - Compound Saving Design
    - Highest Molding quality
    - Built in Hydraulic unit for Multi Plunger Movement
    - Best Compound Flow & Minimum Wire Sweep
    - Applied PKG : All Device

    More View

  • Auto mold chase

    Auto mold chase

    - For test and sample product
    - any chase is available regardless
    - auto molding system manufacturer
    (Fico, Dai-ichi, Seiko, ASM, Towa and so on)
    - capable of reverse engineering

    More View

  • SEMI-MGP mold

    SEMI-MGP mold

    - Various Molding Capacity up to 4Chase
    - Mismatch & Misalign : max 1.5~2 mils
    - High Productivity with Minimum Investment
    - No Resin & No Flash
    - Compound Saving Design
    - Highest Molding quality
    - Built in Hydraulic unit for Multi Plunger Movement
    - Best Compound Flow & Minimum Wire Sweep
    - Applied PKG : All Device

    More View

  • MGP mold

    MGP mold

    - Various Molding Capacity up to 4Chase
    - Mismatch & Misalign : max 1.5~2 mils
    - High Productivity with Minimum Investment
    - No Resin & No Flash
    - Compound Saving Design
    - Highest Molding quality
    - Built in Hydraulic unit for Multi Plunger Movement
    - Best Compound Flow & Minimum Wire Sweep
    - Applied PKG : All Device

    More View

  • MGP and SEMI MGP mold die

    MGP and SEMI MGP mold die

    - Compound saving design
    - highest molding quality with bottom transfer type
    - applicable PKG : all device

    More View

  • Auto mold chase

    Auto mold chase

    - Mismatch & Misalign : max 1~1.5mils
    - Chase Design : Q. C. C
    - High Productivity with Minimum Investment
    - No Resin & No Flash
    - Compound Saving Design
    - Highest Molding quality
    - Built in Hydraulic unit for Multi Plunger Movement
    - Best Compound Flow & Minimum Wire Sweep
    - Applied PKG : All Device

    More View

  • QCC retractable mold die

    QCC retractable mold die

    - Compound saving design
    - highest molding quality
    - applicable PKG : full pack to 220
    - two-step moving of E-pin during molding process

    More View

  • Trim, form and singulation tool

    Trim, form and singulation tool

    - Q.C.C Modular design

    - Easy change & cleaning for tool parts

    - Module change for different lead count & form option

    - Diamond coating for all forming parts

    - Longer life time-less solder build-up

    - Mis feeding detection

    - Un-cut dambar detection (Mechanical type)

    - Minimum in flake solder build-up & foreign materials

    - Top and bottom module self-alignment design

    - Anti vibration & noise protection design

    - Dambar protrusion : max 1.5mils

    - Lead capacity : max 1.5mils

    - Applied package : all package

    - Capable of reserve engineering

    More View

  • Precision injection mold die

  • Stamping mold die and tool