invents and manufactures semiconductor manufacturing equipment and environmental testing equipment,
including LED/LCD equipment, ovens, chambers, and automobile parts testing equipment
for sale both domestically and overseas.
MOLD & TOOL
Test book mold
- Q.C.C Modular design.
- Easy change & cleaning for tool parts.
- Module change for different lead count & form option.
- Diamond coating for all forming parts.
- Longer life time-less solder build-up.
- Mis feeding detection.
- Un-cut dambar detection (Mechanical type).
- Minimum in flake solder build-up & foreign materials.
- Top and bottom module self-alignment design.
- Anti vibration & noise protection design.
- Dambar protrusion : max 1.5mils.
- Lead capacity : max 1.5mils.
- Applied package : all package.
- Capable of reserve engineering.