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Top-A TechnologyPRODUCT

invents and manufactures semiconductor manufacturing equipment and environmental testing equipment,
including LED/LCD equipment, ovens, chambers, and automobile parts testing equipment
for sale both domestically and overseas.

MOLD & TOOL

  • Conventional mold

    Conventional mold

    - Various Molding Capacity up to 12Chase.
    - Mismatch & Misalign : max 1.5~2 mils.
    - High Productivity with Minimum Investment.
    - No Resin & No Flash.
    - Compound Saving Design.
    - Highest Molding quality.
    - Built in Hydraulic unit for Multi Plunger Movement.
    - Best Compound Flow & Minimum Wire Sweep.
    - Applied PKG : All Device.

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  • SEMI-MGP mold

    SEMI-MGP mold

    - Various Molding Capacity up to 4Chase.
    - Mismatch & Misalign : max 1.5~2 mils.
    - High Productivity with Minimum Investment.
    - No Resin & No Flash.
    - Compound Saving Design.
    - Highest Molding quality.
    - Built in Hydraulic unit for Multi Plunger Movement.
    - Best Compound Flow & Minimum Wire Sweep.
    - Applied PKG : All Device.

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  • MGP mold

    MGP mold

    - Various Molding Capacity up to 4Chase.
    - Mismatch & Misalign : max 1.5~2 mils.
    - High Productivity with Minimum Investment.
    - No Resin & No Flash.
    - Compound Saving Design.
    - Highest Molding quality.
    - Built in Hydraulic unit for Multi Plunger Movement.
    - Best Compound Flow & Minimum Wire Sweep.
    - Applied PKG : All Device.

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  • Auto mold chase

    Auto mold chase

    - Mismatch & Misalign : max 1~1.5mils.
    - Chase Design : Q. C. C.
    - High Productivity with Minimum Investment.
    - No Resin & No Flash.
    - Compound Saving Design.
    - Highest Molding quality.
    - Built in Hydraulic unit for Multi Plunger Movement.
    - Best Compound Flow & Minimum Wire Sweep.
    - Applied PKG : All Device.

    More View