PRODUCT

Wafer image capture system

AUTO SYSTEM FOR SEMICONDUCTOR, LCD AND LED

Wafer image capture system

- Barcode scanner for wafer ID (To create image file name)

- High resolution camera (5M Pixel)

- Wafer frame cassette loader (Max. 3 cassettes loading)

- PC based operation 8”/12” wafer convertible type (Conversion Time: 1mintue)

- Full automatic image capture/transfer/ storage

- Die pick & place of the validity verification by interconnection with wafer map system (Optional)

- Highest Molding quality

- Built in Hydraulic unit for Multi Plunger Movement

- Footprint(mm) : 1450(W) x 1175(L) x 2000 (H) 740kg

Features

- This distinguished ‘Wafer image capture system’ will improve the manufacturing process. This will save much need production space that will be freed by not keeping the actual ‘Physical Skeleton Wafer’. Because this system stores the Skeleton wafer images in the computer.

- After die bonding, the camera captures the image of the wafer ring and the remnant defective unit on the tape. The system makes a comparison between this image and wafer inspection data in the server. Thus a real-time information could be obtained if the defective units were assembled.

- As a competitive equipment manufacturer with high technologies, Top-A offers its customers a System for work traceability of die pick and place.

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